Fiona Circular Connector

  ECCN (US): 3A991.b.1.a Automotive: No PPAP: No Cell Type: NAND Chip Density (bit): 128G Architecture: Sectored Timing Type: Synchronous Interface Type: Serial e-MMC Minimum Operating Supply Voltage (V): 1.7|2.7 Typical Operating Supply Voltage (V): 1.8|3.3 Maximum Operating Supply Voltage (V): 1.95|3.6 Minimum Operating Temperature (°C): -25 Maximum Operating Temperature (°C): 85 Mounting: Surface Mount Email: fiona@ingkechips.com

  ECCN (US): 3A991.b.1.a HTS: 8542.32.00.71 Automotive: No PPAP: No Cell Type: MLC NAND Chip Density (bit): 64G Architecture: Sectored Boot Block: Yes Number of Bits/Word (bit): 1/4/8 Number of Words: 64G/16G/8G Programmability: Yes Timing Type: Synchronous Maximum Erase Time (s): 0.02 Interface Type: Serial e-MMC Minimum Operating Supply Voltage (V): 2.7 Maximum Operating Frequency (MHz): 200 Typical Operating Supply Voltage (V): 3|3.3 Maximum Operating Supply Voltage (V): 3.6 Operating Current (mA): 50 Minimum Operating Temperature (°C): -25 Maximum Operating Temperature (°C): 85 Command Compatible: Yes ECC Support: Yes Support of Page Mode: No Mounting: Surface Mount Package Height: 0.49 Package Width: 11.5 Package Length: 13 PCB changed: 153 Standard Package Name: BGA Supplier Package: FBGA Pin Count: 153 Lead Shape: Ball Email: fiona@ingkechips.com