KLM8G1GETF-B041 MLC NAND Flash Serial e-MMC 3V/3.3V 64G-bit 64G/16G/8G x 1/4-bit/8-bit 153-Pin FBGA

 

ECCN (US): 3A991.b.1.a

HTS: 8542.32.00.71

Automotive: No

PPAP: No

Cell Type: MLC NAND

Chip Density (bit): 64G

Architecture: Sectored

Boot Block: Yes

Number of Bits/Word (bit): 1/4/8

Number of Words: 64G/16G/8G

Programmability: Yes

Timing Type: Synchronous

Maximum Erase Time (s): 0.02

Interface Type: Serial e-MMC

Minimum Operating Supply Voltage (V): 2.7

Maximum Operating Frequency (MHz): 200

Typical Operating Supply Voltage (V): 3|3.3

Maximum Operating Supply Voltage (V): 3.6

Operating Current (mA): 50

Minimum Operating Temperature (°C): -25

Maximum Operating Temperature (°C): 85

Command Compatible: Yes

ECC Support: Yes

Support of Page Mode: No

Mounting: Surface Mount

Package Height: 0.49

Package Width: 11.5

Package Length: 13

PCB changed: 153

Standard Package Name: BGA

Supplier Package: FBGA

Pin Count: 153

Lead Shape: Ball

Email: fiona@ingkechips.com